Standard IEC standard · IEC 60749-20 Cor 1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Status: Upphävd

· Ersätts av: IEC 60749-20:2008
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Standard IEC standard · IEC 60749-20 Cor 1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
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Omfattning
Modification of the validity date: now put at 2007.

Ämnesområden

Allmänt Halvledarkomponenter (31.080.01)

Köp denna standard

Standard IEC standard · IEC 60749-20 Cor 1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Pris: 0 SEK
standard ikon

Papper

Produktinformation

Språk: Engelska Franska

Framtagen av: IEC

Internationell titel: Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Artikelnummer: STD-569697

Utgåva: 1

Fastställd: 2003-08-13

Antal sidor: 0

Korrigerar: IEC 60749-20:2002

Ersätts av: IEC 60749-20:2008