Standard IEC standard · IEC 60749-15:2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Status: Upphävd

· Ersätts av: IEC 60749-15:2010
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Standard IEC standard · IEC 60749-15:2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
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Omfattning
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Ämnesområden

Allmänt Halvledarkomponenter (31.080.01)


Köp denna standard

Standard IEC standard · IEC 60749-15:2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Prenumerera på standarden - Läs mer Dölj
Pris: 360 SEK
standard ikon pdf

PDF

Pris: 360 SEK
standard ikon

Papper

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Produktinformation

Språk: Engelska Franska

Framtagen av: IEC

Internationell titel: Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Artikelnummer: STD-562800

Utgåva: 1

Fastställd: 2003-02-07

Antal sidor: 11

Ersätter: IEC 60749:1996/AMD2:2001 , IEC 60749:1996/AMD1:2000 , IEC 60749:1996

Ersätts av: IEC 60749-15:2010