Standard IEC standard · IEC 60749-20:2002

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Status: Withdrawn

· Replaced by: IEC 60749-20:2008 Corrected by: IEC 60749-20 Cor 1 , IEC 60749-20:2002/COR1:2003 Cor 1

Buy this standard

Standard IEC standard · IEC 60749-20:2002

Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions

Subscribe on standards - Read more Dölj

Price: 1 950 SEK

PDF

Price: 1 950 SEK

Paper

Show more Show less

Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Subjects

General (31.080.01)

Discount	- EUR	- SEK
Sum	EUR	SEK
Shipping	EUR	SEK
Vat	EUR	SEK
Total	EUR	SEK

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Subjects

Product information

Within the same area