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Standard IEC standard · IEC 60191-6-12:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Status: Withdrawn

· Replaced by: IEC 60191-6-12:2011
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Standard IEC standard · IEC 60191-6-12:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
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Scope
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Subjects

General (31.080.01)

Buy this standard

Standard IEC standard · IEC 60191-6-12:2002

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions
Subscribe on standards - Read more Dölj
Price: 520 SEK
standard ikon pdf

PDF

Price: 520 SEK
standard ikon

Paper

Show more Show less

Product information

Language: English

Written by: IEC

International title:

Article no: STD-559625

Edition: 1

Approved: 6/14/2002

No of pages: 20

Replaced by: IEC 60191-6-12:2011