Standard IEC standard · IEC 61188-5-1:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Status: Withdrawn

· Replaced by: IEC 61188-6-1:2021

Buy this standard

Standard IEC standard · IEC 61188-5-1:2002

Subscribe on standards with our subscription service. When you use our service you can be assured the latest editions and easy access. Read more about SIS Subscriptions

Subscribe on standards - Read more Dölj

Price: 4 485 SEK

PDF

Price: 4 485 SEK

Paper

Show more Show less

Scope

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Subjects

Printed circuits and boards (31.180) Electronic component assemblies (31.190)

Discount	- EUR	- SEK
Sum	EUR	SEK
Shipping	EUR	SEK
Vat	EUR	SEK
Total	EUR	SEK

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Subjects

Product information

Within the same area